A non-contact precision processing equipment developed for glass substrates (especially brittle, ultra-thin or irregular glass), based on the collaborative technology of "laser marking mechanical fracture", can accurately cut and mark the glass path and achieve one-time neat fracture on a single device, without the need for subsequent edge grinding or secondary processing. It is widely used in efficient molding and processing scenarios for electronic glass (such as OLED display panel glass, consumer electronics cover glass), photovoltaic glass, automotive glass and special optical glass.
